Master's degree in Semiconductor Engineering and Microelectronic Design

Universitat Politècnica de Catalunya · BarcelonaTech

Master's degree in Semiconductor Engineering and Microelectronic Design

Barcelona School of Telecommunications Engineering (ETSETB)

The master's degree in Semiconductor Engineering and Microelectronic Design aims to provide advanced and specialised scientific and technological training in the design and manufacture of integrated, digital and analogue circuits, with an emphasis on applying them in memory systems, communication systems, control systems, computing systems, sensors and emerging devices, such as 2D and quantum devices.

The aim is thus to cover the current shortage of professionals who have this kind of training, which is highly valued in industry at the Spanish and European levels and in research into semiconductor technologies. The master's degree offers comprehensive training that combines the resources and academic excellence of participating universities, which have years of experience in education and research in semiconductor engineering and microelectronic design, and the participation of the Spanish National Research Council’s IMB-CNM, the leading centre in microelectronic technologies.

It is an interuniversity master's degree coordinated by the UPC, with the participation of the Universitat de Barcelona (UB), the Universitat Autònoma de Barcelona (UAB) and the Universitat Rovira i Virgili (URV), and the strategic collaboration of the Institute of Microelectronics of Barcelona (IMB-CNM) of the Spanish National Research Council (CSIC).


  • Semiconductor Engineering
  • Microelectronic Design
Duration and start date
1 academic year, 60 ECTS credits. Starting September
Timetable and delivery
Fees and grants
Approximate fees for the master’s degree, excluding other costs (does not include non-teaching academic fees and issuing of the degree certificate):
€1,660 (€6,331 for non-EU residents).
More information about fees and payment options
More information about grants and loans
Language of instruction

Information on language use in the classroom and students’ language rights.

General requirements
Academic requirements for admission to master's degrees
Pre-enrolment closed (consult the new pre-enrolment periods in the academic calendar).
How to pre-enrol
How to enrol
Legalisation of foreign documents
All documents issued in non-EU countries must be legalised and bear the corresponding apostille.

First semester

  • Analog Ic Design 6
  • Integrated Circuits Physical Design 6
  • Microelectronic Design 6
  • Microelectronic Technologies and Processes 6
  • Packaging, Characterization and Reliability 6
  • Semiconductor Devices 6
  • Semiconductor Facilities and Device Manufacturing 6
  • Soc Design and Verification 6

Second semester

  • Advanced IP Core Design 4
  • Asic Design Techniques for High Secure Systems 4
  • Emerging Technologies for Computing 4
  • Flexible and Printed Electronics 4
  • Innovation, Entrepreneurship and Leadership 6
  • Integrated Photonics 4
  • Integrated Sensors and Circuits for Imagers and Radiation Detectors 4
  • Master's Thesis 10
  • Material Characterization 4
  • Microsensors 4
  • Mixed Signal IP Design 4
  • Power Devices and Systems 4
  • Power Management Circuits in Asics 4
  • RF Ic Design 4
  • Seminars on Microelectronic Industry and Advanced Research 2
  • CompulsoryECTS
  • OptionalECTS
  • ProjectECTS

Print version

link fira virtual
Information sessions

Request information